Hardware preparation for forensic examination
A single focused infrared platform supports three hardware preparation procedures: removing semiconductor components, transferring components to a donor board, and replacing damaged surface-mount components. In each case, reading follows using the laboratory’s own tools.
Chip-Off
Remove eMMC, eMCP, UFS, NAND, CPUs, PMICs and other semiconductor devices. Focused infrared releases the solder joints while keeping the component within its temperature limit.
Learn more 02Chip-Transfer
Transfer components onto donor PCBs with controlled alignment. Split beam optics place the component on a working board so the device can be powered and read.
Learn more 03Chip-Replacement
Remove and replace damaged surface-mount components, such as power ICs and ports, so the board can be read. Controlled, even heating suits fire-damaged, water-damaged and corroded boards.
Learn moreArrange a demonstration
See the system operate on representative devices and boards, and discuss your laboratory’s requirements with our engineers.