Chip-Off
Remove eMMC, eMCP, UFS, NAND, CPUs, PMICs and other semiconductor devices.
The memory device is held to the board by an array of solder joints. Removal requires the solder to reach its melting point while the die a fraction of a millimetre above it stays within its temperature limit. Focused infrared and independent temperature sensing keep the process within this range, and the heated area remains visible throughout.
Independent sensingComponent and board controlled separately
Non-contact infrared sensors measure the component and the board independently, and each is controlled on its own profile. The solder joints reach release temperature while the component stays within its limit.
Process recordSide-view monitoring and image capture
A side-view camera shows the component as it releases, with image capture for the process record. Each step is observed and recorded.
The handoff. After removal, the memory is read in the laboratory’s own validated tools, for example Cellebrite, MSAB XRY, Rusolut VNR, Flash Extractor and Acelab PC-3000. PDR delivers the component to them intact.
Arrange a demonstration
See the system operate on representative devices and boards, and discuss your laboratory’s requirements with our engineers.