The PDR Forensics range
Chipmate Pro
The standard configuration for most forensic work.
Request a QuotationThree systems share the same core: 150W focused, visible infrared heating, three-zone quartz infrared preheating, software thermal profiling and precise temperature sensing. The systems differ in placement, sensing and automation, so a laboratory can select the configuration its work requires.
Chipmate
The entry configuration. Manual operation with a hand-held vacuum tool and thermocouple board sensing, with the full focused infrared heating system.
- Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.
- Independent temperature control. Board and component temperatures are managed separately, for full control of the procedure.
- ThermoActive software. Automatic profiling keeps every thermal procedure controlled and repeatable.
- PCB preheater. 2800W three-zone medium-wave quartz infrared gives controlled, even thermal conditioning from below.
- PCB workholder. Adjustable support positions the board securely and prevents warping.
Full technical specification
- Max PCB size300 x 450 mm
- Max component size55 x 55 mm
- Min component size01005 package
- Component removalHand-held vacuum tool
- Top heater power150W focused IR, up to Ø70 mm spot
- PCB preheater power2800W medium-wave IR, 3 zones
- Preheater heating area360 x 240 mm
- Component sensingNon-contact IR sensor
- PCB sensingK-type thermocouple
- Thermocouple channels4
Chipmate Pro
The standard configuration for most forensic work. Non-contact sensing of both component and board, split beam placement to 10 microns, and a side-view camera with image capture.
- Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy while protecting the surrounding evidence.
- Independent temperature control. Board and component temperatures are managed separately.
- ThermoActive software. Automatic profiling for a controlled, repeatable thermal procedure.
- PCB preheater. 2800W three-zone medium-wave quartz infrared reduces thermal gradients across the board.
- Optical alignment. Split beam prism system for precise component placement and transfer.
- Side-view monitoring. Live camera with image capture for process records.
- Flux application. Precise nest and flux paste application.
- Assisted PCB cooling. Stabilises joints after the procedure.
- Stable PCB support. Adjustable workholder prevents warping.
Full technical specification
- Max PCB size300 x 450 mm
- Max component size55 x 55 mm
- Min component size01005 package
- Component removalManual pick-up system
- Component placementSplit beam prism, x50 magnification
- Placement accuracyUp to 10 microns
- Top heater power150W focused IR, up to Ø70 mm spot
- PCB preheater power2800W medium-wave IR, 3 zones
- Preheater heating area360 x 240 mm
- Component sensingNon-contact IR sensor
- PCB sensingNon-contact IR sensor
- Thermocouple channels4
Chipmate Auto
Automatic component removal and placement. Suitable for higher volumes, or where the same profile is to be run repeatedly.
- Automatic removal and placement. The system lifts and places components automatically at the precise moment, taking operator variability out of the most delicate step.
- Focused infrared heating. 150W focused, adjustable, visible infrared delivers precise energy exactly where it is needed.
- Independent temperature control. Board and component temperatures are managed separately.
- ThermoActive software. Automatic thermal process management for an identical procedure on each component.
- PCB preheater. 2800W three-zone medium-wave quartz infrared preheating.
- Optical alignment. Accurate placement of removed components for transfer and component replacement.
- Side-view monitoring. Live camera with image capture for process records.
- Flux and paste application. Precise application ahead of transfer or component replacement.
- Assisted PCB cooling. Stabilises the board after the procedure.
Full technical specification
- Max PCB size300 x 450 mm
- Max component size55 x 55 mm
- Min component size1 x 1 mm
- Component removalAutomatic removal and placement
- Component placementSplit beam prism, x50 magnification
- Placement accuracyUp to 10 microns
- Top heater power150W focused IR, up to Ø70 mm spot
- PCB preheater power2800W medium-wave IR, 3 zones
- Preheater heating area360 x 240 mm
- Component sensingNon-contact IR sensor
- PCB sensingNon-contact IR sensor
- Thermocouple channels4
Discuss your requirements
Describe your work and volumes, and we will advise on the appropriate configuration.