Chip-Transfer
Transfer components onto donor PCBs while maintaining precise alignment.
Where the memory device is intact but the surrounding board is not, the component can be transferred to a matching donor board. The device can then be powered and read using the laboratory’s own tools. Successful transfer requires accurate placement on every connection.
Split beam alignmentComponent and footprint in one view
A split beam prism overlays the component and its landing site in a single optical view at up to x50 magnification. Placement accuracy is up to 10 microns, so every ball meets its pad.
WorkholderStable, adjustable board support
An adjustable workholder positions the donor board over the preheater and holds it flat throughout the cycle, preventing the warping that affects fine-pitch placement.
Arrange a demonstration
See the system operate on representative devices and boards, and discuss your laboratory’s requirements with our engineers.