Chip-Replacement
Replace damaged components, such as power ICs and ports, so the board can be read.
Fire, water, impact and corrosion often damage surface-mount components before the memory devices. Removing and replacing those components on a damaged board requires even, controlled heating that a compromised laminate can tolerate. Controlled infrared preheating provides this.
Even conditioningEven board preheating
A 2800W three-zone medium-wave infrared preheater conditions the board evenly from below, reducing thermal gradients and stress so that damaged laminates tolerate the work carried out above.
Controlled finishControlled cooling
Assisted cooling brings the board down in a controlled way after reflow, stabilising the solder joints so the board can be handled and moved on to imaging.
Arrange a demonstration
See the system operate on representative devices and boards, and discuss your laboratory’s requirements with our engineers.